Click on image to configure

HIGH DENSITY PRINTED CIRCUIT BOARD CONNECTORS

KFS AND HPH SERIES

• Up to 303 contacts on a 1.905 mm <0.075"> staggered grid.

• 3, 4, 5, & 6 row versions

• Variety of contact terminations and mounting hardware.

• 0.6 mm <0.024"> mating pin diameter.

• Low engagement and withdrawal forces (1.5 oz) nominal per contact.

• Low contact resistance maintained under shock and vibration (7 milliohms max).

• Polyphenylene sulphide insulators for high temperature applications (-55° to + 150° C)

Click on image to configure

HIGH DENSITY PRINTED CIRCUIT BOARD CONNECTORS

KFS AND HPH SERIES

• Up to 303 contacts on a 1.905 mm <0.075"> staggered grid.

• 3, 4, 5, & 6 row versions

• Variety of contact terminations and mounting hardware.

• 0.6 mm <0.024"> mating pin diameter.

• Low engagement and withdrawal forces (1.5 oz) nominal per contact.

• Low contact resistance maintained under shock and vibration (7 milliohms max).

• Polyphenylene sulphide insulators for high temperature applications (-55° C to +150° C)

Click on image to configure

HIGH DENSITY PRINTED CIRCUIT BOARD CONNECTORS

KFS AND HPH SERIES

• Up to 303 contacts on a 1.905 mm <0.075"> staggered grid.

• 3, 4, 5, & 6 row versions

• Variety of contact terminations and mounting hardware.

• 0.6 mm <0.024"> mating pin diameter.

• Low engagement and withdrawal forces (1.5 oz) nominal per contact.

• Low contact resistance maintained under shock and vibration (7 milliohms max).

• Polyphenylene sulphide insulators for high temperature applications (-55° to + 150° C)